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effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation. ... needs to be high for a successful STI CMP process. Ceria based slurries are reported to yield high removal rates , , when compared to silica based slurries , , . Even though ceria based slurries yield high polish rates ...

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1 effect of lanthanum doping in ceria abrasives on sti cmp

1 Effect of lanthanum doping in ceria abrasives on STI CMP

BibTeX @MISC{Praveena_1effect, author = {B. V. S. Praveena and Byoung-jun Choc and Jin-goo Parkb and S. Ramanathana and Ceria Lanthanum}, title = {1 Effect of lanthanum doping in ceria abrasives on STI CMP selectivity}, year = {}}

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effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation. Author links open overlay panel B.V.S. Praveen a Byoung-Jun Cho c Jin-Goo Park b c S. Ramanathan a.

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(pdf) effect of la doping of ceria abrasives for sti cmp

(PDF) Effect of La doping of ceria abrasives for STI CMP

Effect of La doping of ceria abrasives for STI CMP. August 2014; ECS Transactions 61(17):27-35; ... In order to verify that the effect is mainly due to presence of lanthanum, ceria particles were ...

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effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation Article in Materials Science in Semiconductor Processing 33 · May 2015 with ...

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effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation ... The removal rate results show that glycine and proline are sensitive to the La doping in the ceria abrasive whereas the other amino acids studied suppress the nitride removal irrespective of the purity of the abrasives ...

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characterization of the chemical effects of ceria slurries

Characterization of the Chemical Effects of Ceria Slurries

in the fundamentals of the CMP process. In this work, the fundamental properties of ceria abrasives for STI CMP were studied. Ceria slurries are promising for STI CMP because of their intrinsic preferential polishing of oxides over nitrides or polysilicon. This advantageous behavior has been

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abrasive and additive interactions in high selectivity sti

Abrasive and additive interactions in high selectivity STI

Ceria [3,5] and silica [2,6,7] are the most commonly used abrasives for oxide CMP, but high selectivity STI CMP slurries are mostly based on ceria as reviewed by Manivannan and Ramanathan [4]. ...

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abrasive and additive interactions in high selectivity sti

Abrasive and additive interactions in high selectivity STI

rate selectivity during the STI CMP is required. It is known that certain amino acids such as L-proline [3] and L-glutamic acid [4] enhance the selectivity by suppressing the nitride removal rate. Ceria [3, 5] and silica [2, 6, 7] are the most commonly used abrasives for oxide CMP, but high selectivity STI CMP slurries are mostly based on ceria ...

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abrasive and additive interactions in high selectivity sti

Abrasive and additive interactions in high selectivity STI

1. Introduction. Shallow trench isolation (STI) is an important technology in isolating the transistors and chemical mechanical planarization (CMP) is one of the key steps in the STI scheme .In STI CMP, the goal is to remove excess silicon dioxide and protect the active areas using silicon nitride layer .Thus, the silicon nitride acts as a stop layer and a high oxide to nitride removal rate ...

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slurry additive effects on the suppression of silicon

Slurry Additive Effects on the Suppression of Silicon

The effects of single crystalline ceria (CeO2) abrasives in chemical mechanical polishing (CMP) slurries were investigated for silicon dioxide (SiO2) and silicon nitride (Si3N4) CMP process.

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byoung-jun cho's research works | hanyang university

Byoung-Jun Cho's research works | Hanyang University

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation. Article. ... (STI) chemical mechanical planarization (CMP) process to ...

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research work

Research Work

B.V.S. Praveen, Jin Goo Park, S. Ramanathan, Effect of La Doping of Ceria Abrasives on STI CMP Selectivity, ECS Transactions, May 2014 Orlando, FL, USA 61(17) (2014) 27-35 2 B.V.S. Praveen, S. Ramanathan, Effect of additives on polishing of silicon dioxide and silicon nitride for STI CMP, International conference on advanced functional ...

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effect of potassium on sol-gel cerium and lanthanum oxide

Effect of Potassium on Sol-Gel Cerium and Lanthanum Oxide

The catalytic activity in the soot combustion is reported for a series of potassium-promoter alumina supported catalysts prepared by the sol-gel method to be used in the catalytic combustion of soot. The studied systems correspond to CeO2-Al2O3 and La2O3-Al2O3 with charges of 3 and 5 wt% of CeO2 and La2O3. Potassium impregnation is performed to reach 3 atoms of K per nm2 of the mixed oxide.

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doping of ceria surfaces with lanthanum: a dft+ u study

Doping of ceria surfaces with lanthanum: a DFT+ U study

La doping of the (111) and (110) ceria surfaces. The (111) surface is by far the most well studied surface of ceria and is predominantly present in nanoparticles [6], while (110) is the more reactive surface [12] and is present on structures such as nanorods [5]. The DFT + U approach has been shown to provide a consistent treatment of reduced ...

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us20060207188a1 - ceria abrasive for cmp - google patents

US20060207188A1 - Ceria abrasive for cmp - Google Patents

The present invention relates to a CMP abrasive comprising a ceria slurry and a chemical additive having two or more functional groups by mixing and synthesizing a polymeric molecule and a monomer. Also, the present invention relates to a method for a manufacturing CMP abrasive by providing a ceria slurry, manufacturing a chemical additive having two or more functional groups by mixing and ...

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the effect of hydrogen peroxide on polishing removal rate

The effect of hydrogen peroxide on polishing removal rate

The effect of hydrogen peroxide on STI CMP with slurries containing various abrasives was characterized. Hydrogen peroxide does not alter the polishing behavior of silica-based slurries. For ceria-based slurries, the addition of hydrogen peroxide suppressed the silicon dioxide and silicon nitride polish rates over a pH range of 7–10.

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‪b.v.s. praveen‬ - ‪google scholar‬

‪B.V.S. Praveen‬ - ‪Google Scholar‬

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation BVS Praveen, BJ Cho, JG Park, S Ramanathan Material Science in Semiconductor Processing 33, 161-168 , 2015

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doping of ceria surfaces with lanthanum: a dft + u study

Doping of ceria surfaces with lanthanum: a DFT + U study

While trivalent rare earths such as Eu 3 + have recently been shown to enhance the oxidation of CO to CO 2 , there has been relatively little work on La doping of ceria [17, 26]. In this paper, we apply first principles density functional theory, corrected for on-site Coulomb interactions (DFT + U ) [ 27 , 28 ], to study La doping of ceria.

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mssp.manuscript.rev.1

MSSP.Manuscript.rev.1

Title: Microsoft Word - MSSP.Manuscript.rev.1.doc Author: Ramanathan Created Date: 5/22/2015 2:05:26 PM

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